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Smart 3D Devices: Ultra-compact Sensing and Control MEMS

In contrast to the two-dimensional structure of integrated circuits, MEMS technology produces three-dimensional semiconductor structures with sub-micrometer precision. These "smart" structures yield ultra-compact, ultra-fast devices that help OMRON develop optimal new applications for sensing and control in the "Optimization Age."

Questions about OMRON's R&D activities?

Contact

OMRON Corporation
Research & Development Headquarters

Keihanna Innovation Center
9-1 Kizukawadai, Kizukawa-shi
Kyoto 619-0283 Japan

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